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exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 1 sp3222eu/sp3232eu 3.3v, 1000 kbps rs-232 transceivers the sp3222eu and the sp3232eu are 2 driver, 2 receiver rs-232 transceiver solutions intended for portable or hand-held applications such as notebook or palmtop computers. their data transmission rate of 1000 kbps meets the demands of high speed rs-232 ap - plications. the sp3222eu/sp3232eu series has a high-effciency, charge-pump power supply that requires only 0.1f capacitors in 3.3v operation. this charge pump allows the sp3222eu/sp3232eu series to deliver true rs-232 performance from a single power supply ranging from +3.0v to +5.5v. the esd tolerance of the sp3222eu/sp3232eu devices are over +/-15kv for both human body model and iec61000-4-2 air discharge test methods. the sp3222eu device has a low-power shutdown mode where the devices' driver outputs and charge pumps are disabled. during shutdown, the supply current falls to less than 1a. features meets true eia/tia-232-f standards from a +3.0v to +5.5v power supply minimum 1000kbps data rate 1a low power shutdown with receivers active ( sp3222eu ) interoperable with rs-232 down to a +2.7v power source enhanced esd specifcations: + 15kv human body model + 15kv iec61000-4-2 air discharge + 8kv iec61000-4-2 contact discharge ideal for handheld, battery operated applications description selection table now available in lead free packaging v- 1 2 3 4 15 16 17 18 5 6 7 14 13 12 shdn c1+ v+ c1- c2+ c2- en r1in gnd v cc t1out 8 9 10 11 r2in sp3222eu t2out t2in t1in r1out nsoic r2out model power supplies rs-232 drivers rs-232 receivers external components shutdown ttl 3-state # of pins sp3222eu +3.0v to +5.5v 2 2 4 capacitors yes yes 18, 20 sp3232eu +3.0v to +5.5v 2 2 4 capacitors no no 16
2 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 note 1 : v+ and v- can have maximum magnitudes of 7v, but their absolute difference cannot exceed 13v. these are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifcations below is not implied. exposure to absolute maximum rating conditions for extended periods of time may affect reliability and cause permanent damage to the device. v cc .......................................................-0.3v to +6.0v v+ (note 1).......................................-0.3v to +7.0v v- (note 1)........................................+0.3v to -7.0v v+ + |v-| (note 1)...........................................+13v i cc (dc v cc or gnd current)......................... + 100ma input voltages txin, en, shdn.........................-0.3v to vcc + 0.3v rxin................................................................... + 25v output voltages txout............................................................. + 13.2v rxout, .......................................-0.3v to (v cc +0.3v) short-circuit duration txout....................................................continuous storage temperature......................-65c to +150c unless otherwise noted, the following specifcations apply for v cc = +3.0v to +5.5v with t amb = t min to t max , c 1 to c 4 = 0.1 f. typical values apply at vcc = +3.3v and t amb = 25 c power dissipation per package 20-pin ssop (derate 9.25mw/ o c above +70 o c)..............750mw 18-pin soic (derate 15.7mw/ o c above +70 o c)..............1260mw 20-pin tssop (derate 11.1mw/ o c above +70 o c).............890mw 16-pin ssop (derate 9.69mw/ o c above +70 o c)...............775mw 16-pin pdip (derate 14.3mw/ o c above +70 o c)...............1150mw 16-pin wide soic (derate 11.2mw/ o c above +70 o c)........900mw 16-pin tssop (derate 10.5mw/ o c above +70 o c)..............850mw 16-pin nsoic (derate 13.57mw/ o c above +70 o c)...........1086mw electrical characteristics parameter min. typ. max. units conditions dc characteristics supply current 0.3 1.0 ma no load, v cc = 3.3v, t amb = 25 o c, txin = gnd or v cc shutdown supply current 1.0 10 a shdn = gnd, vcc = 3.3v, t amb = 25 o c, txin = vcc or gnd logic inputs and receiver outputs input logic threshold low gnd 0.8 v txin, en, shdn, note 2 input logic threshold high 2.0 v vcc = 3.3v, note 2 input logic threshold high 2.4 vcc v vcc = 5.0v, note 2 input leakage current + 0.01 + 1.0 a txin, en, shdn, t amb = +25 o c, v in = 0v to v cc output leakage current + 0.05 + 10 a receivers disabled, v out = 0v to v cc output voltage low 0.4 v i out = 1.6ma output voltage high v cc -0.6 v cc -0.1 v i out = -1.0ma driver outputs output voltage swing + 5.0 + 5.4 v all driver outputs loaded with 3k? to gnd, t amb = +25 o c absolute maximum ratings
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 3 electrical characteristics parameter min. typ. max. units conditions driver outputs (continued) output resistance 300 ? v cc = v+ = v- = 0v, t out = + 2v output short-circuit current + 35 + 60 ma v out = 0v output leakage current + 25 a v cc = 0v or 3.0v to 5.5v, v out = + 12v, drivers disabled receiver inputs input voltage range -25 +25 v input threshold low 0.6 1.2 v vcc = 3.3v input threshold low 0.8 1.5 v vcc = 5.0v input threshold high 1.5 2.4 v vcc = 3.3v input threshold high 1.8 2.4 v vcc = 5.0v input hysteresis 0.3 v input resistance 3 5 7 k? timing characteristics maximum data rate 1000 kbps r l = 3k?, c l = 250pf, one driver switching receiver propagation delay, t phl 0.15 s receiver input to receiver output, c l = 150pf receiver propagation delay, t plh 0.15 s receiver input to receiver output, c l = 150pf receiver output enable time 200 ns receiver output disable time 200 ns driver skew 100 ns | t phl - t plh |, t amb = 25 c receiver skew 50 ns | t phl - t plh | transition-region slew rate 90 v/s vcc = 3.3v, r l = 3k?, t amb = 25 c, measurements taken from -3.0v to +3.0v or +3.0v to -3.0v note 2: driver input hysteresis is typically 250mv. unless otherwise noted, the following specifcations apply for v cc = +3.0v to +5.5v with t amb = t min to t max , c 1 to c 4 = 0.1 f. typical values apply at vcc = +3.3v and t amb = 25 c
4 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 unless otherwise noted, the following performance characteristics apply for v cc = +3.3v, 1000kbps data rate, all drivers loaded with 3k?, 0.1f charge pump capacitors, and t amb = +25 c. figure 2. slew rate vs load capacitance for the sp3222eu and sp3232eu figure 1. transmitter output voltage vs load capacitance for the sp3222eu and sp3232eu 0 250 500 1000 1500 load capacitance (pf) t ransmitter output voltage (v) 6 4 2 0 -2 -4 -6 t1 at 1mbps t2 at 62.5kbps figure 3. supply current vs. load capacitance when transmitting data for the sp3222eu and sp3232eu typical performance characteristics 0 250 500 1000 1500 2000 load capacitance (pf) slew rate (v/ s) 120 100 80 60 40 20 0 t1 at 1mbps t2 at 62.5kbps all tx loaded 3k // cload 0 250 500 1000 1500 load capacitance (pf) supply current (ma) 35 30 20 15 10 5 0 t1 at 1mbps t2 at 62.5kbps figure 4. supply current vs. supply voltage for the sp3222eu and sp3232eu 2.7 3 3.5 4 4.5 5 supply v oltage (v) supply current (ma) 20 15 10 5 0 t1 at 1mbps t2 at 62.5kbps figure 5. transmitter output voltage vs supply voltage for the sp3222eu and sp3232eu figure 6. transmitter skew vs. load capacitance for the sp3222eu and sp3232eu 2.7 3 3.5 4 4.5 5 supply v oltage (v) t ransmitter output v oltage (v) 6 4 2 0 -2 -4 -6 t1 at 1mbps t2 at 62.5kbps 0 250 500 1000 1500 2000 200 150 100 50 0 load capacitance (pf) skew (ns) t1 at 500kbps t2 at 31.2kbps all tx loaded 3k // cload
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 5 table 1. device pin description name function pin number sp3222eu sp3232eu soic ssop tssop en receiver enable. apply logic low for normal operation. apply logic high to disable the receiver outputs (high-z state) 1 1 - c1+ positive terminal of the voltage doubler charge-pump capacitor 2 2 1 v+ +5.5v output generated by the charge pump 3 3 2 c1- negative terminal of the voltage doubler charge-pump capacitor 4 4 3 c2+ positive terminal of the inverting charge-pump capacitor 5 5 4 c2- negative terminal of the inverting charge-pump capacitor 6 6 5 v- -5.5v output generated by the charge pump 7 7 6 t 1 out rs-232 driver output. 15 17 14 t 2 out rs-232 driver output. 8 8 7 r 1 in rs-232 receiver input 14 16 13 r 2 in rs-232 receiver input 9 9 8 r 1 out ttl/cmos receiver output 13 15 12 r 2 out ttl/cmos receiver output 10 10 9 t 1 in ttl/cmos driver input 12 13 11 t 2 in ttl/cmos driver input 11 12 10 gnd ground 16 18 15 v cc +3.0v to +5.5v supply voltage 17 19 16 shdn shutdown control input. drive high for normal device operation. drive low to shutdown the drivers (high-z output) and the on- board power supply 18 20 - n.c. no connect - 11, 14 - pin function
6 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 figure 8. pinout confguration for the sp3232eu figure 7. pinout confgurations for the sp3222eu v- 1 2 3 4 17 18 19 20 5 6 7 16 15 14 shdn c1+ v+ c1- c2+ c2- n.c . en r1in gnd v cc t1out n.c . 8 9 10 11 12 13 r2in r2out sp3222eu t2out t1in t2in r1out ssop/tssop v- 1 2 3 4 15 16 17 18 5 6 7 14 13 12 shdn c1+ v+ c1- c2+ c2- en r1in gnd v cc t1out 8 9 10 11 r2in sp3222eu t2out t2in t1in r1out nsoic r2out v- 1 2 3 4 13 14 15 16 5 6 7 12 11 10 c1+ v+ c1- c2+ c2- r1in r2in gnd v cc t1out t2in 8 9 sp3232eu t1in r1out r2out t2out pinout
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 7 figure 9. sp3222eu typical operating circuits sp3222eu 2 4 6 5 3 7 19 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 13 12 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + *c3 c4 + + 0.1 f 0.1 f 8 17 rs-232 outputs rs-232 inputs logic inputs v cc 18 1 5k ? r1in r1out 15 9 5k ? r2in r2out 10 16 logic outputs en 20 shdn *can be retur ned to either v cc or gnd ssop tssop sp3222eu 2 4 6 5 3 7 17 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 12 11 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + *c3 c4 + + 0.1 f 0.1 f 8 15 rs-232 outputs rs-232 inputs logic inputs v cc 16 1 5k? r1in r1out 13 9 5k? r2in r2out 10 14 logic outputs en 18 shdn *can be retur ned to either v cc or gnd wsoic figure 10. sp3232eu typical operating circuit sp3232eu 1 3 5 4 2 6 16 gnd t1in t2in t1out t2out c1+ c1- c2+ c2- v+ v- v cc 11 10 0.1f + c2 c5 c1 + + *c3 c4 + + 14 7 rs-232 outputs rs-232 inputs logic inputs v cc 15 5k? r1in r1out 12 13 5k? r2in r2out 9 8 logic outputs *can be retur ned to either v cc or gnd 0.1f 0.1f 0.1f 0.1f typical operating circuits
8 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 the sp3222eu/sp3232eu transceivers meet the eia/tia-232 and itu-t v.28/v.24 communication protocols and can be imple - mented in battery-powered, portable, or hand-held applications such as notebook or palmtop computers. the sp3222eu/ sp3232eu devices feature exar's propri - etary on-board charge pump circuitry that generates 5.5v for rs-232 voltage levels from a single +3.0v to +5.5v power supply. this series is ideal for +3.3v-only systems, mixed +3.3v to +5.5v systems, or +5.0v- only systems that require true rs-232 performance. the sp3222eu/sp3232eu devices can operate at a minimum data rate of 1000kbps. the sp3222eu and sp3232eu are 2- driver/2- receiver devices ideal for portable or hand-held applications. the sp3222eu features a 1a shutdown mode that reduces power consumption and extends battery life in portable systems. its receivers remain active in shutdown mode, allowing external devices such as modems to be monitored using only 1a supply current. theory of operation the sp3222eu/sp3232eu series is made up of three basic circuit blocks: 1. drivers 2. receivers 3. the exar proprietary charge pump drivers the drivers are inverting level transmitters that convert ttl or cmos logic levels to + 5.0v eia/tia-232 levels with an inverted sense relative to the input logic levels. typically, the rs-232 output voltage swing is + 5.4v with no load and + 5v minimum fully loaded. the driver outputs are protected against infnite short-circuits to ground with - out degradation in reliability. driver outputs will meet eia/tia-562 levels of +/-3.7v with supply voltages as low as 2.7v. the drivers have a minimum data rate of 1000kbps fully loaded with 3k? in parallel with 250pf, ensuring compatability with pc- to-pc communication software. figure 11 shows a loopback test circuit used to test the rs-232 drivers. figure 12 shows the test results of the loopback circuit with all drivers active at 250kbps with rs-232 loads in parallel with a 1000pf capacitor. figure 13 shows the test results where one driver was active at 1000kbps and all drivers loaded with an rs-232 receiver in parallel with 250pf capacitors. the sp3222eu driver's output stages are turned off (tri-state) when the device is in shutdown mode. when the power is off, the sp3222eu device permits the outputs to be driven up to +/-12v. the driver's inputs do not have pull-up resistors. designers should connect unused inputs to vcc or gnd. in the shutdown mode, the supply current falls to less than 1a, where shdn = low. when the sp3222eu device is shut down, the device's driver outputs are disabled (tri- stated) and the charge pumps are turned off with v+ pulled down to vcc and v- pulled to gnd. the time required to exit shutdown is typically 100s. connect shdn to vcc if the shutdown mode is not used. receivers the receivers convert eia/tia-232 levels to ttl or cmos logic output levels. the sp3222eu receivers have an inverting tri-state output. these receiver outputs (rxout) are tri-stated when the enable control en = high. in the shutdown mode, the receivers can be active or inactive. en has no effect on txout. the truth table logic of the sp3222eu driver and receiver outputs can be found in table 2. description
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 9 since receiver input is usually from a trans - mission line where long cable lengths and system interference can degrade the signal, the inputs have a typical hysteresis margin of 300mv. this ensures that the receiver is virtually immune to noisy transmission lines. should an input be left unconnected, an internal 5k? pulldown resistor to ground will commit the output of the receiver to a high state. charge pump the charge pump is an exar-patended design (u.s. 5,306,954) and uses a unique approach compared to older less-effcient designs. the charge pump still requires four external capacitors, but uses a four-phase voltage shifting technique to attain sym - metrical 5.5v power supplies. the internal power supply consists of a regulated dual charge pump that provides output voltages of +/-5.5v regardless of the input voltage (vcc) over the +3.0v to +5.5v range. in most circumstances, decoupling the power supply can be achieved adequately using a 0.1f bypass capacitor at c5 (refer to fgures 9 and 10). in applications that are sensitive to power-supply noise, decouple vcc to ground with a capacitor of the same value as charge-pump capacitor c1. physi - cally connect bypass capcitors as close to the ic as possible. table 2. sp3222eu truth table logic for shutdown and enable control figure 11. sp3222eu/sp3232eu driver loopback test circuit figure 13. loopback test results at 1000kbps figure 12. loopback test results at 250kbps sp3222eu sp3232eu gnd txin txout c1+ c1- c2+ c2- v+ v- v cc 0.1 f 0.1 f 0.1 f + c2 c5 c1 + + c3 c4 + + 0.1 f 0.1 f logic inputs v cc 5k? rxin rxout logic outputs en* *shdn 250pf or 1000pf v cc * sp3222eu only shdn en txout rxout 0 0 tri-state active 0 1 tri-state tri-state 1 0 active active 1 1 active tri-state description
10 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 the charge pump operates in a discontinu - ous mode using an internal oscillator. if the output voltages are less than a magnitude of 5.5v, the charge pump is enabled. if the output voltages exceed a magnitude of 5.5v, the charge pump is disabled. this oscillator controls the four phases of the voltage shift - ing. a description of each phase follows. phase 1 v ss charge storage during this phase of the clock cycle, the positive side of capaci - tors c 1 and c 2 are initially charged to v cc . c l + is then switched to gnd and the charge in c 1 C is transferred to c 2 C . since c 2 + is con - nected to v cc , the voltage potential across capacitor c 2 is now 2 times v cc . phase 2 v ss transfer phase two of the clock connects the negative terminal of c 2 to the v ss storage capacitor and the positive terminal of c 2 to gnd. this transfers a negative gener - ated voltage to c 3 . this generated voltage is regulated to a minimum voltage of -5.5v. simultaneous with the transfer of the volt - age to c 3 , the positive side of capacitor c 1 is switched to v cc and the negative side is connected to gnd. phase 3 v dd charge storage the third phase of the clock is identical to the frst phase the charge transferred in c 1 produces Cv cc in the negative terminal of c 1 , which is applied to the negative side of capacitor c 2 . since c 2 + is at v cc , the voltage potential across c 2 is 2 times v cc . phase 4 v dd transfer the fourth phase of the clock connects the negative terminal of c 2 to gnd, and transfers this positive generated voltage across c 2 to c 4 , the v dd storage capacitor. this voltage is regulated to +5.5v. at this voltage, the in - ternal oscillator is disabled. simultaneous with the transfer of the voltage to c 4 , the positive side of capacitor c 1 is switched to v cc and the negative side is con - nected to gnd, allowing the charge pump cycle to begin again. the charge pump cycle will continue as long as the operational conditions for the internal oscillator are present. since both v + and v C are separately gener - ated from v cc , in a noCload condition v + and v C will be symmetrical. older charge pump approaches that generate v C from v + will show a decrease in the magnitude of v C compared to v + due to the inherent ineffciencies in the design. the clock rate for the charge pump typically operates at greater than 250khz. the exter - nal capacitors can be as low as 0.1f with a 16v breakdown voltage rating. description
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 11 figure 15. charge pump phase 2 v cc = +5 v v ss storage capacitor v dd storage capacit o r c 1 c 2 c 3 c 4 + + + + ? ? ? ? -5.5v v cc = +5v ?5v ?5v +5v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + + + ? ? ? ? figure 14. charge pump phase 1 figure 17. charge pump phase 3 v cc = +5v ?5v ?5v +5v v ss storage capacitor v dd storage capacitor c 1 c 2 c 3 c 4 + + + + ? ? ? ? figure 18. charge pump phase 4 v cc = +5 v v ss storage capacitor v dd storage capacit o r c 1 c 2 c 3 c 4 + + + + ? ? ? ? +5.5v figure 16. charge pump waveforms ch1 2.00v ch2 2.00v m 1.00 s ch1 5.48v 2 1 t t [ ] t +6v a) c 2+ b) c 2 - gnd gnd -6v description
12 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 esd t olerance the sp3222e/sp3232e series incorpo - rates ruggedized esd cells on all driver output and receiver input pins. the esd structure is improved over our previous family for more rugged applications and environments sensitive to electro-static discharges and associated transients. the improved esd tolerance is at least + 15kv without damage nor latch-up. there are different methods of esd testing applied: a) mil-std-883, method 3015.7 b) iec 61000-4-2 air-discharge c) iec 61000-4-2 direct contact the human body model has been the generally accepted esd testing method for semi-conductors. this method is also specifed in mil-std-883, method 3015.7 for esd testing. the premise of this esd test is to simulate the human bodys potential to store electro-static energy and discharge it to an integrated circuit. the simulation is performed by using a test model as shown in figure 19. this method will test the ics capability to withstand an esd transient during normal handling such as in manu - facturing areas where the ics tend to be handled frequently. the iec-61000-4-2, formerly iec801-2, is generally used for testing esd on equipment and systems. for system manufacturers, they must guarantee a certain amount of esd protection since the system itself is exposed to the outside environment and human presence. the premise with iec 61000-4-2 is that the system is required to withstand an amount of static electricity when esd is applied to points and surfaces of the equipment that are accessible to personnel during normal usage. the transceiver ic receives most of the esd current when the esd source is applied to the connector pins. the test circuit for iec 61000-4-2 is shown on figure 20. there are two methods within iec 61000-4-2, the air discharge method and the contact discharge method. with the air discharge method, an esd voltage is applied to the equipment under test (eut) through air. this simulates an electrically charged person ready to connect a cable onto the rear of the system only to fnd an unpleasant zap just before the person touches the back panel. the high energy potential on the person discharges through an arcing path to the rear panel of the system before he or she even touches the system. this energy, whether discharged directly or through air, is predominantly a function of the discharge current rather than the discharge voltage. variables with an air discharge such as approach speed of the object carrying the esd potential to the system and humidity will tend to change the discharge current. for example, the rise time of the discharge current varies with the approach speed. the contact discharge method applies the esd current directly to the eut. this method was devised to reduce the unpredictability of the esd arc. the discharge current rise time is constant since the energy is directly transferred without the air-gap arc. in situ - ations such as hand held systems, the esd charge can be directly discharged to the figure 19. esd test circuit for human body model r c devic e under test dc power sourc e c s r s sw1 sw2 description
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 13 device pin human b ody iec61000-4-2 tested model air discharge direct contact level driver outputs + 15kv + 15kv + 8kv 4 receiver inputs + 15kv + 15kv + 8kv 4 equipment from a person already holding the equipment. the current is transferred on to the keypad or the serial port of the equipment directly and then travels through the pcb and fnally to the ic. the circuit models in figures 19 and 20 rep - resent the typical esd testing circuit used for all three methods. the c s is initially charged with the dc power supply when the frst switch (sw1) is on. now that the capacitor is charged, the second switch (sw2) is on while sw1 switches off. the voltage stored in the capacitor is then applied through r s , the current limiting resistor, onto the device under test (dut). in esd tests, the sw2 switch is pulsed so that the device under test receives a duration of voltage. for the human body model, the current limiting resistor (r s ) and the source capacitor (c s ) are 1.5k? an 100pf, respectively. for iec-61000-4-2, the current limiting resistor (r s ) and the source capacitor (c s ) are 330? an 150pf, respectively . figure 21. esd test waveform for iec61000-4-2 figure 20. esd test circuit for iec61000-4-2 table 3. transceiver esd tolerance levels r s and r v add up to 330 for iec61000-4-2. r c devic e under test dc power sourc e c s r s sw1 sw2 r v contact-discharge model t = 0ns t = 30ns 0a 15a 30a i t the higher c s value and lower r s value in the iec61000-4-2 model are more stringent than the human body model. the larger storage capacitor injects a higher voltage to the test point when sw2 is switched on. the lower current limiting resistor increases the current charge onto the test point. description
14 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 package: 16 pin ssop
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 15 package: 18 pin wsoic
16 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 package: 16 pin nsoic
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 17 package: 16 pin tssop
18 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 package: 20 pin tssop
exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 19 ordering information note: "/tr" is for tape and reel option. "-l" is for lead free packaging part number temp. range package sp3222euct-l 0c to +70c 18 pin wsoic sp3222euct-l/tr 0c to +70c 18 pin wsoic sp3222eucy-l 0c to +70c 20 pin tssop sp3222eucy-l/tr 0c to +70c 20 pin tssop SP3222EUET-L -40c to +85c 18 pin wsoic SP3222EUET-L/tr -40c to +85c 18 pin wsoic sp3222euey-l -40c to +85c 20 pin tssop sp3222euey-l/tr -40c to +85c 20 pin tssop part number temp. range package sp3232euca-l 0c to +70c 16 pin ssop sp3232euca-l/tr 0c to +70c 16 pin ssop sp3232eucn-l 0c to +70c 16 pin nsoic sp3232eucn-l/tr 0c to +70c 16 pin nsoic sp3232eucy-l 0c to +70c 16 pin tssop sp3232eucy-l/tr 0c to +70c 16 pin tssop sp3232euea-l -40c to +85c 16 pin ssop sp3232euea-l/tr -40c to +85c 16 pin ssop sp3232euey-l -40c to +85c 16 pin tssop sp3232euey-l/tr -40c to +85c 16 pin tssop
20 exar corporation 48720 kato road, fremont ca, 94538 ? 510-668-7017 ? www.exar.com sp3222eu/sp3232eu_101_061711 revision history notice exar corporation reserves the right to make changes to any products contained in this publication in order to improve design, performance or reli - ability. exar corporation assumes no representation that the circuits are free of patent infringement. charts and schedules contained herein are only for illustration purposes and may vary depending upon a user's specifc application. while the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. exar corporation does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reasonably be expected to cause failure of the life support system or to signifcantly af fect its safety or effectiveness. products are not authorized for use in such applications unless exar corporation receives, in writting, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized ; (b) the user assumes all such risks; (c) potential liability of exar corporation is adequately protected under the circumstances. copyright 2011 exar corporation datasheet june 2011 for technical questions please email exar's serial technical support group at: serialtechsupport@exar.com reproduction, in part or whole, without the prior written consent of exar corporation is prohibited. date revision description 02/31/06 -- legacy sipex datasheet 12/08/10 1.0.0 convert to exar format and update ordering information. 06/17/11 1.0.1 remove eol devices per pdn 110510-05

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